Senior Engineer – 3D Packaging Development

About the role

The Hong Kong Applied Science and Technology Research Institute (ASTRI) seeks a Senior Engineer to lead advanced 3D package process development. You will work on cutting‑edge through‑glass‑via (TGV) and through‑silicon‑via (TSV) technologies, translating research into market‑ready solutions.

Key responsibilities

• Develop and optimise advanced packaging processes such as etching, electroplating, thinning, 3D stacking and dicing for TGV/TSV applications.
• Collaborate with product design and material development teams to define optimal process windows for engineering prototypes.
• Transfer technical solutions to customers and provide on‑site technical support.
• Perform ad‑hoc duties as required to support project goals.

Required profile

• Bachelor’s degree or higher in Mechanical, Material, Chemical Engineering or a related discipline.
• Minimum 2 years of experience in advanced packaging and process development (candidates with less experience may be considered for an Engineer role).
• Strong communication and interpersonal abilities; a collaborative team player.
• Commitment to ASTRI’s values and mission.

Required skills

• Advanced packaging techniques (etching, electroplating, thinning, 3D stacking, dicing).
• Experience with TGV and TSV technologies.
• Process development and optimisation.
• Prototype engineering and on‑site technical support.

What we offer

• Renewable fixed‑term contract with competitive salary and performance‑linked variable pay.
• Paid leave, medical insurance coverage and MPF contribution.
• Five‑day work week in a leading research environment.