Head of Mechanical Design

About the role

We are looking for a Head of Mechanical Design to lead the mechanical and packaging development of next‑generation 1.6 Tb/s client‑side optical transceivers. The role combines high‑speed optical module expertise with thermal and reliability engineering, working closely with cross‑functional teams to deliver manufacturable, high‑performance solutions.

Key responsibilities

• Lead mechanical and packaging design for 1.6 Tb/s optical modules, including housing, PCB integration and thermal strategies.
• Develop advanced packaging solutions covering die bonding, wire bonding and optical coupling (fiber, lens, mirror).
• Perform thermal simulations (ANSYS, FloTHERM, Icepak) and design heat‑sink, vapor‑chamber and TIM solutions.
• Drive DFM/DFA improvements, create SOPs and work with contract manufacturers to ensure high‑yield production.
• Collaborate with optical, electrical and test engineers to optimise module performance and cost.
• Mentor junior engineers and lead design reviews, failure analysis and continuous improvement initiatives.

Required profile

• Bachelor’s or Master’s degree in Mechanical, Packaging, Optical or related engineering.
• 5+ years of experience in mechanical design and packaging of optical transceivers or semiconductor components.
• Proven experience with high‑speed (800 G/400 G) client‑side optical modules or equivalent.

Required skills

• Mechanical design and packaging for optical modules
• Die bonding, wire bonding and optical coupling techniques
• Thermal management (heat sinks, vapor chambers, TIMs)
• Thermal simulation tools: ANSYS, FloTHERM, Icepak
• Design for Manufacturability (DFM) and Design for Assembly (DFA)
• PCB layout integration and housing design